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Grinder
Single-Side Polisher
Double-Side Polisher
Wax Bonder / Wafer Scrubber
Panel CMP
TPP-5120
An operator manually places the carrier plate onto the loading/unloading workstation. The workstation then transfers the plate onto the upper polishing platen for automated polishing. The machine is equipped with friction-based endpoint detection, which automatically stops the process once the target value is reached.
  • Wafer Size

    515*510mm / 600*600mm

  • Number of Polishing Heads

    1

  • Polishing head diameter

    OD930 mm

  • Diameter of polishing disc

    OD1300 mm

    • Features
    Endpoint Detection
    Equipped with advanced high-precision EPD (Endpoint Detection) monitoring function
    Zonal Pressure Control
    Optimize pressure distribution to ensure polishing uniformity
    High Compatibility
    The equipment is compatible with substrates of different sizes
    Semi-Automatic Loading/Unloading
    Unique Light-Touch Loading/Unloading System to Avoid Damage
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