久久久噜噜噜久久熟女88,春药潮吹2800cc,mm131亚洲精品久久,国产成人久久综合777777麻豆,日本婷婷久久一区二区,影音先锋综合伊人久久,日韩欧美中文字幕一区二区三区,亚洲性爱?中文字幕?一区?二区?国产精品

Grinder
Single-Side Polisher
Double-Side Polisher
Wax Bonder / Wafer Scrubber
Single-Side Polisher
TAP-400/450/500/600 series
This series of polishing machine comprises double-spindle high-precision single-sided polishing equipment. These machines can be equipped with corresponding polishing heads for different wafers, fix wafers by vacuum adsorption, and pressurize using air bags. The polishing head can rotate and swing. They are suitable for polishing various semiconductor materials.
  • Plate Specifications

    OD400 mm

  • Number of Polishing Heads

    2

  • Polishing Head Swing

    Adjustable Swing & Speed

    • Features
    Drive mode
    Polishing head rotates and swings at meantime
    Pressurizing method
    Vacuum adsorption fixed wafer airbag pressurization
    Constant temperature control
    Temperature control system for polishing plate
    Abundant configurations
    Double spindle processing, equipped with polishing plate conditioner
    Good compatibility
    Different type of polishing heads are available to match different type of wafer
    Pressure calibration
    Precision weighing sensor to monitor downward pressure
    Convenient processing
    The semi-automatic wafer loading and unloading system is optional
    Submitted successfully
    We will contact you as soon as possible.
    Submission failed
    Please refresh the page and resubmit.
    Follow Us
    • >